Essential details
Quantity(pieces):1
MOQ:1 Piece
G.W:0.6 kg
Lead time:10-15 Days
Size:L(12)*W(6)*H(6) cm
N.W:0.35 kg
Shipping:Express
Specification Number:SCP-SS316L-001
Package Description:Inside: Ultrasonic cleaned and degreased in a Class 1000 cleanroom environment. Wrapped with anti-static film and EPE foam. Securely held by custom-cut high-density foam to prevent vibration and scratches on the high-gloss surface. Outside: Cleanroom-grade double-wall corrugated box.
Product Introduction
Precision semiconductor component processing using advanced CNC technology, delivering high accuracy, excellent surface quality, and reliable performance for semiconductor equipment applications.